Epoxy molding materials exhibit very low viscosity when filling a mold and therefore offer the designer flexibility in encapsulating sensitive electronic components and in forming high-density pin connectors. Sumitomo Bakelite North America's Epoxy materials retain a high percentage of their properties.
Key Properties:
Thermal
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Glass transition temperatures of 155°C - 175°C
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Resistance to thermal shock
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Low outgassing in high vacuum
Electrical
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High insulation resistance even after long exposure to high temperature and humidity
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Low dielectric loss
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High arc resistance, even under adverse conditions
Chemical
Corrosion Resistance
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Epoxy